SYSTEM AND METHOD FOR SYSTEM LEVEL COOLING OF AN ARRAY OF MEMORY MODULES

A cooling system interface for system cooling of a plurality of memory modules comprises a plurality of thermal interface material (TIM) blankets and a heatsink comprising a plurality of conductive fins. A TIM blanket may be positioned on each memory module and the heatsink may be positioned relative to the array of memory modules such that a conductive fin is positioned between two adjacent memory modules and a conduction fin is positioned relative to the memory modules on each end of the array. Each TIM blanket comprises a thickness based on components on the memory module and each conduction fin has a rigidity and thickness to ensure conformal contact between the TIM blanket and a conduction fin. Slidable contact between the conduction fins and TIM blankets allows the cooling system interface to be removed for servicing the memory module.