MICROPHONE ARRANGEMENT

A microphone arrangement includes a carrier structure having a rear surface, a front surface and a through-hole between the rear surface and the front surface, and a microphone having an enclosure, the enclosure comprising a rear section that fits into the through-hole and a front section that seats...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Czinege, Flórián
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:	A microphone arrangement includes a carrier structure having a rear surface, a front surface and a through-hole between the rear surface and the front surface, and a microphone having an enclosure, the enclosure comprising a rear section that fits into the through-hole and a front section that seats on the front surface of the carrier structure around the through-hole, the front section of the microphone enclosure has a front surface and a rear surface. A microphone cover layer covers the front surface of the front section of the microphone enclosure.