Battery-free and Substrate-free IoT and AI System Package

Battery-free and Substrate-free IoT and AI System Package

A tetherless system-in-package includes a first integrated circuit (IC) chip having interconnects and energy harvesting elements. A super-capacitor is configured to store a charge output by the energy harvesting elements. At least a second IC chipset including a smart chip and an optical I/O or an R...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Libsch, Frank Robert, Bedell, Stephen W, Li, Ning
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A tetherless system-in-package includes a first integrated circuit (IC) chip having interconnects and energy harvesting elements. A super-capacitor is configured to store a charge output by the energy harvesting elements. At least a second IC chipset including a smart chip and an optical I/O or an RF I/O is aligned and bonded to at least one of the interconnects of the first IC chip. The first IC chip and the second IC chip are configured to receive a portion of the charge stored by the super-capacitor.