PACKAGE STRUCTURE

A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN, CHEN-HSIU, LEE, CHENG-YING, TSAI, MING-SUNG
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.