HEAT MANAGEMENT DEVICE

A heat management device may include: a first heat circuit in which first heat medium circulates; a second heat circuit in which second heat medium circulates; a first radiator disposed in the first heat circuit; a second radiator disposed in the second heat circuit; and vehicle equipment exchanging...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TASHIRO, Hiroki, HASEGAWA, Yoshio, IKEGAMI, Makoto
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A heat management device may include: a first heat circuit in which first heat medium circulates; a second heat circuit in which second heat medium circulates; a first radiator disposed in the first heat circuit; a second radiator disposed in the second heat circuit; and vehicle equipment exchanging heat with the first heat medium. The first and the second radiator may be disposed such that the first heat medium and the second heat medium are able to exchange heat with each other, the first heat medium may be heated by heat exchange between the first and the second heat medium in a case where a temperature of the second heat medium flowing into the second radiator is higher than a temperature of the first heat medium flowing into the first radiator, and the first heat medium heats the vehicle equipment by exchanging heat with the vehicle equipment.