SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

A method includes: providing a package body including a mounting part having a chip mounting region for mounting a semiconductor chip, a side wall part having a first sealing surface continuously provided over an entire perimeter of the mounting part, surrounding the chip mounting region and provide...

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Bibliographische Detailangaben
1. Verfasser: TSUJI, Seiichi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method includes: providing a package body including a mounting part having a chip mounting region for mounting a semiconductor chip, a side wall part having a first sealing surface continuously provided over an entire perimeter of the mounting part, surrounding the chip mounting region and provided on the mounting part, a first recess provided on the first sealing surface, and a first solder outflow prevention part continuously provided on the first sealing surface and positioned closer to the chip mounting region side than the first recess; providing a cap having a second sealing surface facing the first sealing surface; providing a ball solder made of an alloy of gold and tin as principal ingredients; placing the ball solder in the first recess; placing the cap on the ball solder; and melting once and then solidifying the ball solder to bond the first sealing surface and the second sealing surface.