SEMICONDUCTOR DEVICE, INSPECTION COMPONENT, AND INSPECTION DEVICE

According to one embodiment, a semiconductor device includes a board, a plurality of external connection terminals, a semiconductor component, and an insulator. The board includes a first surface and a second surface. The second surface is located on a side opposite to the first surface. The plurali...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IDE, Kohei, FUKUDA, Kenshi
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	According to one embodiment, a semiconductor device includes a board, a plurality of external connection terminals, a semiconductor component, and an insulator. The board includes a first surface and a second surface. The second surface is located on a side opposite to the first surface. The plurality of external connection terminals is on the first surface. The semiconductor component is located on a side opposite to the plurality of external connection terminals with respect to the board. The insulator includes a first region and a second region. The first region has a first thickness in a thickness direction of the board. The second region is located on an outer peripheral side of the first region and has a second thickness thinner than the first thickness in the thickness direction. The insulator covers the semiconductor component from a side opposite to the board.