METHODS OF UTILIZING LOW TEMPERATURE SOLDER ASSISTED MOUNTING TECHNIQUES FOR PACKAGE STRUCTURES

Methods/structures of joining package structures are described. Those methods/structures may include a device disposed on first side of substrate and an array of conductive interconnect structures disposed on a second side of the first substrate. The conductive interconnect structures of the array m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Raravikar, Nachiket R, Sane, Sandeep B, Karhade, Omkar G
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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