METHODS OF UTILIZING LOW TEMPERATURE SOLDER ASSISTED MOUNTING TECHNIQUES FOR PACKAGE STRUCTURES

METHODS OF UTILIZING LOW TEMPERATURE SOLDER ASSISTED MOUNTING TECHNIQUES FOR PACKAGE STRUCTURES

Methods/structures of joining package structures are described. Those methods/structures may include a device disposed on first side of substrate and an array of conductive interconnect structures disposed on a second side of the first substrate. The conductive interconnect structures of the array m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Raravikar, Nachiket R, Sane, Sandeep B, Karhade, Omkar G
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Methods/structures of joining package structures are described. Those methods/structures may include a device disposed on first side of substrate and an array of conductive interconnect structures disposed on a second side of the first substrate. The conductive interconnect structures of the array may comprise a solder material, wherein the solder material comprises a low temperature alloying element concentration of less than about 5 percent. A second substrate is coupled to the array of conductive interconnect structures.