PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIN FILM HAVING PATTERN, RESIN FILM HAVING PATTERN, AND SEMICONDUCTOR CIRCUIT SUBSTRATE

A photosensitive resin composition contains: a polymer (A) having a terminal group represented by Formula (a1) and a repeating structural unit represented by Formula (a2); a crosslinking agent (B); and a photocation generator (C). Y represents a reactive group that reacts with the crosslinking agent (B) by action of a cation generated from the photocation generator (C) upon light irradiation; each X independently represents an oxygen atom, a sulfur atom, an ester bond, an amide bond, or -SO2-; R1 represents a divalent hydrocarbon group or a divalent group in which a functional group other than the reactive group and heterocycles is introduced into the divalent hydrocarbon group; and R2 represents a divalent hydrocarbon group, a divalent group in which a functional group other than the reactive group and heterocycles is introduced into the divalent hydrocarbon group, or a heterocycle-containing group that does not have the reactive group.-X-R1-Y (a1)R2-X-R1-X (a2)