SEMICONDUCTOR DEVICE

Disclosed in an embodiment is a semiconductor device comprising: a conductive substrate; a semiconductor structure, which is arranged on the conductive substrate, comprises a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer arranged between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and comprises a plurality of recesses which pass through the second conductive type semiconductor layer and the active layer and up to a partial region of the first conductive type semiconductor layer; a first electrode electrically connecting the first conductive type semiconductor layer to the conductive substrate; a second electrode electrically connected to the second conductive type semiconductor layer; and an insulating layer arranged inside the plurality of recesses, wherein the plurality of recesses comprise a first recess extending along the outer surface of the semiconductor structure and a plurality of second recesses arranged on the inner side of the first recess, the first electrode comprises a plurality of protrusion electrodes extending to the inside of the second recess so as to be electrically connected to the first conductive type semiconductor layer, the active layer comprises an inactive area arranged between a side surface of the semiconductor structure and the first recess, and an active area arranged on the inner side of the first recess, and the emission intensity of the inactive area is less than the emission intensity of the active area.