METAL TAB FOR CHIP ASSEMBLY

A semiconductor die having a metal tab connected thereto. The metal tab includes at least one slot on at least one side of the metal tab, wherein the at least one slot i) creates an opening between at least two portions of the metal tab and ii) exposes the semiconductor die in relation to the metal tab. The semiconductor die can be a silicon (Si) die and the metal tab can be a copper (Cu) tab, where the at least one slot includes at least four slots corresponding to each of at least four sides of the metal, and wherein with respect to each of the at least four sides, each corresponding slot i) creates an opening between at least two portions of the Cu metal tab and ii) exposes the Si semiconductor die in relation to the Cu metal tab.