FILM THICKNESS MEASUREMENT DEVICE AND CORRECTION METHOD

A film thickness measurement device according to one aspect of the present disclosure includes: a first computing unit configured to, for each location on a first wafer having a known thickness other than a reference location on the first wafer, calculate a relative reflectance of a reflection spectral signal of reflected light detected by a collection probe, with respect to a reference reflection spectral signal of reflected light detected by the collection probe at the reference location on the first wafer; a specifying unit configured to specify a relationship between the relative reflectance calculated by the first computing unit and distance data representing a distance between the location on the first wafer and the collection probe; a second computing unit configured to calculate relative reflectances each corresponding to distance data representing a distance between the collection probe and a corresponding location on a second wafer to be measured, based on the relationship specified by the specifying unit; and a correction unit configured to, in calculating film thickness at each location on the second wafer, correct the reference reflection spectral signal based on the relative reflectances calculated by the second computing unit.