METHOD FOR MANUFACTURING DEVICE, AND COMPOSITION

A method for manufacturing a device including a substrate and a second film disposed above the substrate includes: forming a first film above the substrate using a composition containing a polymerizable monomer and an oxidation inhibitor; and forming the second film by curing the first film in a sta...

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Bibliographische Detailangaben
1. Verfasser:	OSAKI, Takeshi
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A method for manufacturing a device including a substrate and a second film disposed above the substrate includes: forming a first film above the substrate using a composition containing a polymerizable monomer and an oxidation inhibitor; and forming the second film by curing the first film in a state where at least one part of a mold having a convexo-concave pattern is in contact with the first film, or after at least one part of the mold is brought into contact with the first film. The oxidation inhibitor is at least one of a hindered amine compound and a hindered phenol compound having a molecular weight of 700 or more. The composition satisfies a relationship of (t0(T)−tx(T))/t0(T)×100≤13.0. (t0(T) is a height of a convex part of cured film obtained by the specific method, and tx(T) is the corresponding height after heating at 260° C.)