SUBSTRATE PROCESSING SYSTEM AND METHOD TO REDUCE A NUMBER OF EXTERNAL CONNECTORS PROVIDED ON THE SYSTEM

Embodiments of substrate processing systems and methods are provided for reducing the number of external connectors provided on a substrate processing system for receiving liquids and gases from external liquid and gas sources. In one embodiment, a substrate processing system includes a plurality of...

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Bibliographische Detailangaben
1. Verfasser:	Verbaas, Melvin
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	Embodiments of substrate processing systems and methods are provided for reducing the number of external connectors provided on a substrate processing system for receiving liquids and gases from external liquid and gas sources. In one embodiment, a substrate processing system includes a plurality of processing units for processing a substrate; a plurality of external connectors for receiving liquids and/or gases from a plurality of sources stored outside of the substrate processing system; and a plurality of internal distribution lines for routing the liquids and/or gases from the external connectors to the processing units. The disclosed substrate processing system reduces the number of external connectors provided on the system by: (a) including only one external connector for each liquid and gas source, and (b) providing a plurality of internal distribution lines within the substrate processing system for routing liquids and gases from the external connectors to the processing units.