SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

Semiconductor packages described herein include a thermal capacitor designed to absorb transient heat pulses from a power semiconductor die and subsequently release the transient heat pulses to a surrounding environment, and/or a recessed pad feature. Corresponding methods of production are also des...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Naeve, Tomasz, Palm, Petteri, Cho, Eung San
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Semiconductor packages described herein include a thermal capacitor designed to absorb transient heat pulses from a power semiconductor die and subsequently release the transient heat pulses to a surrounding environment, and/or a recessed pad feature. Corresponding methods of production are also described.