SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

A method of processing a substrate includes: (a) placing the substrate on an electrostatic chuck, and applying a direct current voltage to the electrostatic chuck to hold the substrate on the electrostatic chuck; (b) supplying a radio frequency power to an electrode to generate plasma of an inert ga...

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Bibliographische Detailangaben
Hauptverfasser: YONEDA, Shigeru, SHINDO, Nobuaki, HAMA, Yasutaka
Format: Patent
Sprache:eng
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Zusammenfassung:A method of processing a substrate includes: (a) placing the substrate on an electrostatic chuck, and applying a direct current voltage to the electrostatic chuck to hold the substrate on the electrostatic chuck; (b) supplying a radio frequency power to an electrode to generate plasma of an inert gas; (c) stopping the application of the direct current voltage to the electrostatic chuck; and (d) gradually decreasing the radio frequency power supplied to the electrode to 0 W.