Polyamide Resin Composition and Molded Product Comprising Same
The polyamide resin composition of the present invention comprises: about 15 to about 49 wt % of an aromatic polyamide resin containing a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2; about 1 to about 30 wt % of a polyamide resin having a gl...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | HONG, Sang Hyun SEO, Yeong Deuk LEE, Sang Hwa |
description | The polyamide resin composition of the present invention comprises: about 15 to about 49 wt % of an aromatic polyamide resin containing a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2; about 1 to about 30 wt % of a polyamide resin having a glass transition temperature of about 40 to about 120° C.; about 1 to about 20 wt % of an olefin-based copolymer; about 5 to about 40 wt % of calcium carbonate; and about 5 to about 40 wt % of talc. The polyamide resin composition and the molded product formed therefrom are excellent in plating adhesion, impact resistance, stiffness, heat resistance, flowability, appearance characteristics, and the like. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021214555A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021214555A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021214555A13</originalsourceid><addsrcrecordid>eNrjZLALyM-pTMzNTElVCEotzsxTcM7PLcgvzizJzM9TSMxLUfDNz0lJTVEIKMpPKU0uAUsXZQIVpisEJ-am8jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMjQyNDE1NTU0dDY-JUAQD-7TEy</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Polyamide Resin Composition and Molded Product Comprising Same</title><source>esp@cenet</source><creator>HONG, Sang Hyun ; SEO, Yeong Deuk ; LEE, Sang Hwa</creator><creatorcontrib>HONG, Sang Hyun ; SEO, Yeong Deuk ; LEE, Sang Hwa</creatorcontrib><description>The polyamide resin composition of the present invention comprises: about 15 to about 49 wt % of an aromatic polyamide resin containing a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2; about 1 to about 30 wt % of a polyamide resin having a glass transition temperature of about 40 to about 120° C.; about 1 to about 20 wt % of an olefin-based copolymer; about 5 to about 40 wt % of calcium carbonate; and about 5 to about 40 wt % of talc. The polyamide resin composition and the molded product formed therefrom are excellent in plating adhesion, impact resistance, stiffness, heat resistance, flowability, appearance characteristics, and the like.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&CC=US&NR=2021214555A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&CC=US&NR=2021214555A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HONG, Sang Hyun</creatorcontrib><creatorcontrib>SEO, Yeong Deuk</creatorcontrib><creatorcontrib>LEE, Sang Hwa</creatorcontrib><title>Polyamide Resin Composition and Molded Product Comprising Same</title><description>The polyamide resin composition of the present invention comprises: about 15 to about 49 wt % of an aromatic polyamide resin containing a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2; about 1 to about 30 wt % of a polyamide resin having a glass transition temperature of about 40 to about 120° C.; about 1 to about 20 wt % of an olefin-based copolymer; about 5 to about 40 wt % of calcium carbonate; and about 5 to about 40 wt % of talc. The polyamide resin composition and the molded product formed therefrom are excellent in plating adhesion, impact resistance, stiffness, heat resistance, flowability, appearance characteristics, and the like.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALyM-pTMzNTElVCEotzsxTcM7PLcgvzizJzM9TSMxLUfDNz0lJTVEIKMpPKU0uAUsXZQIVpisEJ-am8jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMjQyNDE1NTU0dDY-JUAQD-7TEy</recordid><startdate>20210715</startdate><enddate>20210715</enddate><creator>HONG, Sang Hyun</creator><creator>SEO, Yeong Deuk</creator><creator>LEE, Sang Hwa</creator><scope>EVB</scope></search><sort><creationdate>20210715</creationdate><title>Polyamide Resin Composition and Molded Product Comprising Same</title><author>HONG, Sang Hyun ; SEO, Yeong Deuk ; LEE, Sang Hwa</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021214555A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HONG, Sang Hyun</creatorcontrib><creatorcontrib>SEO, Yeong Deuk</creatorcontrib><creatorcontrib>LEE, Sang Hwa</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HONG, Sang Hyun</au><au>SEO, Yeong Deuk</au><au>LEE, Sang Hwa</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polyamide Resin Composition and Molded Product Comprising Same</title><date>2021-07-15</date><risdate>2021</risdate><abstract>The polyamide resin composition of the present invention comprises: about 15 to about 49 wt % of an aromatic polyamide resin containing a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2; about 1 to about 30 wt % of a polyamide resin having a glass transition temperature of about 40 to about 120° C.; about 1 to about 20 wt % of an olefin-based copolymer; about 5 to about 40 wt % of calcium carbonate; and about 5 to about 40 wt % of talc. The polyamide resin composition and the molded product formed therefrom are excellent in plating adhesion, impact resistance, stiffness, heat resistance, flowability, appearance characteristics, and the like.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US2021214555A1 |
source | esp@cenet |
subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP |
title | Polyamide Resin Composition and Molded Product Comprising Same |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T10%3A43%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HONG,%20Sang%20Hyun&rft.date=2021-07-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021214555A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |