Polyamide Resin Composition and Molded Product Comprising Same

The polyamide resin composition of the present invention comprises: about 15 to about 49 wt % of an aromatic polyamide resin containing a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2; about 1 to about 30 wt % of a polyamide resin having a glass transition temperature of about 40 to about 120° C.; about 1 to about 20 wt % of an olefin-based copolymer; about 5 to about 40 wt % of calcium carbonate; and about 5 to about 40 wt % of talc. The polyamide resin composition and the molded product formed therefrom are excellent in plating adhesion, impact resistance, stiffness, heat resistance, flowability, appearance characteristics, and the like.