HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF

Provided is a heat-curable resin composition capable of yielding a cured product that has a superior dielectric property and heat resistance and is thus useful for high-frequency purposes. Particularly, there are provided a composition containing the following components (A), (C) and (D); and a comp...

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Bibliographische Detailangaben
Hauptverfasser: TSUTSUMI, Yoshihiro, OSADA, Shoichi, HORIGOME, Hiroki
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided is a heat-curable resin composition capable of yielding a cured product that has a superior dielectric property and heat resistance and is thus useful for high-frequency purposes. Particularly, there are provided a composition containing the following components (A), (C) and (D); and a composition containing the following components (A) and (B). The components (A), (B), (C) and (D) are:(A) a cyclopentadiene compound represented by the following formula (1) and/or an oligomer(s) of the cyclopentadiene compoundwherein R represents a group selected from an alkyl group, an alkenyl group and an aryl group, n represents an integer of 1 to 4, each of x1 and x2 independently represents 0, 1 or 2, provided that when R represents an alkyl group or an aryl group, x1 represents 1 or 2, and x1 and x2 satisfy 1≤x1+x2≤4;(B) a cyclic imide compound;(C) a curing accelerator; and(D) an inorganic filler.