POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY

POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY

Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FUNG, Jason G, JAWALI, Puneet Narendra, KAKIREDDY, Veera Raghava Reddy, KIM, Jaeseok, KHANNA, Aniruddh Jagdish, BARADANAHALLI KENCHAPPA, Nandan, YAMAMURA, Mayu, MANZONIE, Adam Wade, AN, Joonho, BAJAJ, Rajeev
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.