CONDUCTIVE POLYGON POWER AND GROUND INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES

Disclosed embodiments include conductive polygon power and ground interconnects in an infield formed by an electrical contact array. The conductive polygon ground interconnects are orthogonally reticulated an among the conductive polygon power interconnects, for integrated-circuit device packages th...

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Hauptverfasser:	Lim, Ken Beng, Teh, Pheak Ti, Bin Abdullah, Mohd Muhaiyiddin, Loh, Lee Ping
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	Lim, Ken Beng Teh, Pheak Ti Bin Abdullah, Mohd Muhaiyiddin Loh, Lee Ping
description	Disclosed embodiments include conductive polygon power and ground interconnects in an infield formed by an electrical contact array. The conductive polygon ground interconnects are orthogonally reticulated an among the conductive polygon power interconnects, for integrated-circuit device packages that provide a low-loss path to active and passive devices, by minimizing resistive loops.
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title	CONDUCTIVE POLYGON POWER AND GROUND INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES
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