CONDUCTIVE POLYGON POWER AND GROUND INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES
Disclosed embodiments include conductive polygon power and ground interconnects in an infield formed by an electrical contact array. The conductive polygon ground interconnects are orthogonally reticulated an among the conductive polygon power interconnects, for integrated-circuit device packages th...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Disclosed embodiments include conductive polygon power and ground interconnects in an infield formed by an electrical contact array. The conductive polygon ground interconnects are orthogonally reticulated an among the conductive polygon power interconnects, for integrated-circuit device packages that provide a low-loss path to active and passive devices, by minimizing resistive loops. |
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