PACKAGE SUBSTRATE AND MULTI-CHIP PACKAGE INCLUDING THE SAME

PACKAGE SUBSTRATE AND MULTI-CHIP PACKAGE INCLUDING THE SAME

A package substrate, including a substrate, a first structure disposed on the substrate and having a first through-portion, a first wiring layer disposed in the first through-portion on the substrate, a first insulating layer disposed in the first through-portion on the substrate and covering at lea...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ji, Yun Je, Kim, Tae Seong
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package substrate, including a substrate, a first structure disposed on the substrate and having a first through-portion, a first wiring layer disposed in the first through-portion on the substrate, a first insulating layer disposed in the first through-portion on the substrate and covering at least a portion of the first wiring layer, and a second wiring layer disposed on the first insulating layer, and a multi-chip package, including the package substrate, are provided.