CLEANING COMPOSITION

A cleaning composition is disclosed. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and hydrogen bond acceptor are present at a molar ratio of from about 5:1 to about 1.5:1.

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Bibliographische Detailangaben
Hauptverfasser: Barnabas, Freddy Arthur, Waning, Gregory Thomas, Bacca, Lori Ann
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A cleaning composition is disclosed. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and hydrogen bond acceptor are present at a molar ratio of from about 5:1 to about 1.5:1.