CLEANING COMPOSITION
A cleaning composition is disclosed. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and hydrogen bond acceptor are present at a molar ratio of from about 5:1 to about 1.5:1.
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A cleaning composition is disclosed. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and hydrogen bond acceptor are present at a molar ratio of from about 5:1 to about 1.5:1. |
---|