SYSTEM FOR ADJUSTING PAD SURFACE TEMPERATURE AND POLISHING APPARATUS

A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply lin...

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Bibliographische Detailangaben
Hauptverfasser: MARUYAMA, TORU, UOZUMI, SHUJI, KOMATSU, MITSUNORI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device (40) that controls operations of the pump device (32) and the needle valve (MNV).