SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND MOVABLE BODY
A semiconductor module includes: a first terminal portion and a second terminal portion each connected to outside; and a first current path and a second current path to connect between the first terminal portion and the second terminal portion in parallel. The first current path includes: a first se...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A semiconductor module includes: a first terminal portion and a second terminal portion each connected to outside; and a first current path and a second current path to connect between the first terminal portion and the second terminal portion in parallel. The first current path includes: a first semiconductor device; a first wiring portion and a second wiring portion. The second current path includes: a second semiconductor device; a third wiring portion; and a fourth wiring portion. A power conducting capability of the first semiconductor device is lower than a power conducting capability of the second semiconductor device, and a total of an impedance of the first wiring portion and an impedance of the second wiring portion is lower than a total of an impedance of the third wiring portion and an impedance of the fourth wiring portion. |
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