SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND MOVABLE BODY

A semiconductor module includes: a first terminal portion and a second terminal portion each connected to outside; and a first current path and a second current path to connect between the first terminal portion and the second terminal portion in parallel. The first current path includes: a first se...

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Bibliographische Detailangaben
1. Verfasser: SAKAI, Junya
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor module includes: a first terminal portion and a second terminal portion each connected to outside; and a first current path and a second current path to connect between the first terminal portion and the second terminal portion in parallel. The first current path includes: a first semiconductor device; a first wiring portion and a second wiring portion. The second current path includes: a second semiconductor device; a third wiring portion; and a fourth wiring portion. A power conducting capability of the first semiconductor device is lower than a power conducting capability of the second semiconductor device, and a total of an impedance of the first wiring portion and an impedance of the second wiring portion is lower than a total of an impedance of the third wiring portion and an impedance of the fourth wiring portion.