WIREBOND CROSS-TALK REDUCTION FOR QUANTUM COMPUTING CHIPS

A configuration of wirebonds for reducing cross-talk in a quantum computing chip includes a first wirebond coupling a first conductor of a quantum computing circuit with a first conductor of an external circuit. The embodiment further includes in the configuration a second wirebond coupling a second conductor of the quantum computing circuit with a second conductor of the external circuit, wherein the first wirebond and the second wirebond are separated by a first vertical distance in a direction of a length of the first conductor.