METHOD AND DEVICE FOR MACHINING A COMPONENT BY REMOVING MATERIAL

METHOD AND DEVICE FOR MACHINING A COMPONENT BY REMOVING MATERIAL

Provided is a method for machining a component by removing material, in particular by removing chips, within a groove provided in the component, in which method: spatially resolved measurement data, which include information about faults, in particular cracks in the component, are provided, and mach...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Clossen-von Lanken Schulz, Michael, Obermayr, Stefan
Format: Patent
Sprache:eng
Schlagworte:
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
MILLING
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:Provided is a method for machining a component by removing material, in particular by removing chips, within a groove provided in the component, in which method: spatially resolved measurement data, which include information about faults, in particular cracks in the component, are provided, and machining of the component by removing material, in particular by removing chips, is performed by means of at least one machining tool mounted for movement in a motorized manner, in particular for translation and/or pivoting in a motorized manner, and is controlled in accordance with the provided measurement data preferably in an automated manner with respect to the positions on the component at which the at least one machining tool is brought into engagement with the component in order to remove material in the region of faults that are present.