LOW-PRESSURE CHIP PACKAGING TYPE JUNCTION BOX AND PROCESSING METHOD THEREOF FOR SOLAR POWER GENERATION ASSEMBLY
Provided is a low-pressure chip packaging type junction box for a solar power generation assembly and a processing method thereof, and more particularly, relates to a low-pressure chip packaging type junction box for a solar power generation assembly integrating techniques relating to development an...
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creator | ZHANG, Daoyuan JIANG, Liwang ZHU, Dibao LI, Qianjin |
description | Provided is a low-pressure chip packaging type junction box for a solar power generation assembly and a processing method thereof, and more particularly, relates to a low-pressure chip packaging type junction box for a solar power generation assembly integrating techniques relating to development and manufacturing of junction boxes with semiconductor packaging techniques to increase a degree of product automation and a processing method thereof. The low-pressure chip packaging type junction box for a solar power generation assembly comprises a box body, N chips, N connection members, and N+1 copper conductors, where N≥1. At least one accommodation recess is arranged at the box body. The box body is provided with a transverse bar. Chip installation positions are arranged at N copper conductors. The N+1 copper conductors are provided with lead-out positions positioned at a top surface of the transverse bar. The chip is welded and fixed to the installation position at the copper conductor. |
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The low-pressure chip packaging type junction box for a solar power generation assembly comprises a box body, N chips, N connection members, and N+1 copper conductors, where N≥1. At least one accommodation recess is arranged at the box body. The box body is provided with a transverse bar. Chip installation positions are arranged at N copper conductors. The N+1 copper conductors are provided with lead-out positions positioned at a top surface of the transverse bar. The chip is welded and fixed to the installation position at the copper conductor.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-REDRADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, E.G. 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The low-pressure chip packaging type junction box for a solar power generation assembly comprises a box body, N chips, N connection members, and N+1 copper conductors, where N≥1. At least one accommodation recess is arranged at the box body. The box body is provided with a transverse bar. Chip installation positions are arranged at N copper conductors. The N+1 copper conductors are provided with lead-out positions positioned at a top surface of the transverse bar. The chip is welded and fixed to the installation position at the copper conductor.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-REDRADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, E.G. 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USINGPHOTOVOLTAIC [PV] MODULES</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG, Daoyuan</creatorcontrib><creatorcontrib>JIANG, Liwang</creatorcontrib><creatorcontrib>ZHU, Dibao</creatorcontrib><creatorcontrib>LI, Qianjin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG, Daoyuan</au><au>JIANG, Liwang</au><au>ZHU, Dibao</au><au>LI, Qianjin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LOW-PRESSURE CHIP PACKAGING TYPE JUNCTION BOX AND PROCESSING METHOD THEREOF FOR SOLAR POWER GENERATION ASSEMBLY</title><date>2021-05-13</date><risdate>2021</risdate><abstract>Provided is a low-pressure chip packaging type junction box for a solar power generation assembly and a processing method thereof, and more particularly, relates to a low-pressure chip packaging type junction box for a solar power generation assembly integrating techniques relating to development and manufacturing of junction boxes with semiconductor packaging techniques to increase a degree of product automation and a processing method thereof. The low-pressure chip packaging type junction box for a solar power generation assembly comprises a box body, N chips, N connection members, and N+1 copper conductors, where N≥1. At least one accommodation recess is arranged at the box body. The box body is provided with a transverse bar. Chip installation positions are arranged at N copper conductors. The N+1 copper conductors are provided with lead-out positions positioned at a top surface of the transverse bar. The chip is welded and fixed to the installation position at the copper conductor.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-REDRADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, E.G. USINGPHOTOVOLTAIC [PV] MODULES SEMICONDUCTOR DEVICES |
title | LOW-PRESSURE CHIP PACKAGING TYPE JUNCTION BOX AND PROCESSING METHOD THEREOF FOR SOLAR POWER GENERATION ASSEMBLY |
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