LOW-PRESSURE CHIP PACKAGING TYPE JUNCTION BOX AND PROCESSING METHOD THEREOF FOR SOLAR POWER GENERATION ASSEMBLY

Provided is a low-pressure chip packaging type junction box for a solar power generation assembly and a processing method thereof, and more particularly, relates to a low-pressure chip packaging type junction box for a solar power generation assembly integrating techniques relating to development and manufacturing of junction boxes with semiconductor packaging techniques to increase a degree of product automation and a processing method thereof. The low-pressure chip packaging type junction box for a solar power generation assembly comprises a box body, N chips, N connection members, and N+1 copper conductors, where N≥1. At least one accommodation recess is arranged at the box body. The box body is provided with a transverse bar. Chip installation positions are arranged at N copper conductors. The N+1 copper conductors are provided with lead-out positions positioned at a top surface of the transverse bar. The chip is welded and fixed to the installation position at the copper conductor.