METHOD OF MANUFACTURING ELECTRONIC MODULE, METHOD OF MANUFACTURING OPTICAL MODULE, ELECTRONIC MODULE, OPTICAL MODULE, AND DEVICE

A method of manufacturing an electronic module that comprises preparing an electronic device in which a first substrate and a second substrate have been joined and coupling the electronic device to a package member. The first substrate includes a front surface, a back surface on an opposite side of...

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Bibliographische Detailangaben
1. Verfasser:	Tsukano, Jun
Format:	Patent
Sprache:	eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	A method of manufacturing an electronic module that comprises preparing an electronic device in which a first substrate and a second substrate have been joined and coupling the electronic device to a package member. The first substrate includes a front surface, a back surface on an opposite side of the front surface, and a first side surface between an edge portion of the front surface and an edge portion of the back surface. The package member includes a first portion that includes an opening and a second portion that is arranged at a position which does not overlap the opening. The coupling includes bringing the first side surface into contact with the second portion in a state in which the second substrate is positioned between the first portion and the first substrate, and fixing the package member and the electronic device.