SOFT POLYOLEFIN RESIN COMPOSITION WITH IMPROVED DIRECT-CURRENT INSULATION CHARACTERISTICS AND ARTICLE MOLDED THEREFROM

A soft polyolefin resin composition and an article molded therefrom are provided. The polyolefin resin includes: (A) 50 to 95% by weight of an ethylene-propylene block copolymer obtained by polymerization of a propylene homopolymer or an ethylene-propylene random copolymer with an ethylene-propylene...

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Bibliographische Detailangaben
Hauptverfasser: CHUN, YongSung, LEE, Eunwoong, KIM, BongSeock
Format: Patent
Sprache:eng
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Zusammenfassung:A soft polyolefin resin composition and an article molded therefrom are provided. The polyolefin resin includes: (A) 50 to 95% by weight of an ethylene-propylene block copolymer obtained by polymerization of a propylene homopolymer or an ethylene-propylene random copolymer with an ethylene-propylene rubber copolymer in stages in reactors; (B) 4.8 to 40% by weight of an ethylene-α-olefin rubber copolymer; and (C) 0.2 to 10% by weight of a copolymer of ethylene and a polar monomer, based on the total weight of components (A) to (C). The glass transition temperature of the rubber component in the ethylene-propylene block copolymer appears at −60 to −40° C. when measured by a dynamic mechanical analyzer, the melt index of the polyolefin resin composition measured at 230° C. under a load of 2.16 kg is 0.5 to 20 g/10 minutes, and the glass transition temperature of the rubber component in the polyolefin resin composition appears at −60 to −40° C. when measured by a dynamic mechanical analyzer.