DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE

DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE

An apparatus is described. The apparatus includes a printed circuit board (PCB), a heating element and a layer of material that is physically integrated with a surface of the PCB. The layer of material is to apply an expansive or contractive force to a surface of the PCB in response to being warmed...

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Hauptverfasser: FREY, Emery E, GULICK, John C, THIBADO, Jonathan W
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator FREY, Emery E
GULICK, John C
THIBADO, Jonathan W
description An apparatus is described. The apparatus includes a printed circuit board (PCB), a heating element and a layer of material that is physically integrated with a surface of the PCB. The layer of material is to apply an expansive or contractive force to a surface of the PCB in response to being warmed by heat generated by the heating element. The expansive or contractive force is to cause the first surface to expand with a first coefficient of thermal expansion that is closer to a second coefficient of thermal expansion of an opposite surface of the PCB than the surface's coefficient of thermal expansion without the expansive or contractive force.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2021120663A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2021120663A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2021120663A13</originalsourceid><addsrcrecordid>eNrjZNBz8fT19PMM9nB1UQgI8vQLAdLOnkHOoZ4hCk7-jkEuChoBzk6aCuGOQQGO7q48DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-NNjIwMjQ0MjAzMzY0dCYOFUAUBQmMw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE</title><source>esp@cenet</source><creator>FREY, Emery E ; GULICK, John C ; THIBADO, Jonathan W</creator><creatorcontrib>FREY, Emery E ; GULICK, John C ; THIBADO, Jonathan W</creatorcontrib><description>An apparatus is described. The apparatus includes a printed circuit board (PCB), a heating element and a layer of material that is physically integrated with a surface of the PCB. The layer of material is to apply an expansive or contractive force to a surface of the PCB in response to being warmed by heat generated by the heating element. The expansive or contractive force is to cause the first surface to expand with a first coefficient of thermal expansion that is closer to a second coefficient of thermal expansion of an opposite surface of the PCB than the surface's coefficient of thermal expansion without the expansive or contractive force.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210422&amp;DB=EPODOC&amp;CC=US&amp;NR=2021120663A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210422&amp;DB=EPODOC&amp;CC=US&amp;NR=2021120663A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FREY, Emery E</creatorcontrib><creatorcontrib>GULICK, John C</creatorcontrib><creatorcontrib>THIBADO, Jonathan W</creatorcontrib><title>DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE</title><description>An apparatus is described. The apparatus includes a printed circuit board (PCB), a heating element and a layer of material that is physically integrated with a surface of the PCB. The layer of material is to apply an expansive or contractive force to a surface of the PCB in response to being warmed by heat generated by the heating element. The expansive or contractive force is to cause the first surface to expand with a first coefficient of thermal expansion that is closer to a second coefficient of thermal expansion of an opposite surface of the PCB than the surface's coefficient of thermal expansion without the expansive or contractive force.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBz8fT19PMM9nB1UQgI8vQLAdLOnkHOoZ4hCk7-jkEuChoBzk6aCuGOQQGO7q48DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-NNjIwMjQ0MjAzMzY0dCYOFUAUBQmMw</recordid><startdate>20210422</startdate><enddate>20210422</enddate><creator>FREY, Emery E</creator><creator>GULICK, John C</creator><creator>THIBADO, Jonathan W</creator><scope>EVB</scope></search><sort><creationdate>20210422</creationdate><title>DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE</title><author>FREY, Emery E ; GULICK, John C ; THIBADO, Jonathan W</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2021120663A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>FREY, Emery E</creatorcontrib><creatorcontrib>GULICK, John C</creatorcontrib><creatorcontrib>THIBADO, Jonathan W</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FREY, Emery E</au><au>GULICK, John C</au><au>THIBADO, Jonathan W</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE</title><date>2021-04-22</date><risdate>2021</risdate><abstract>An apparatus is described. The apparatus includes a printed circuit board (PCB), a heating element and a layer of material that is physically integrated with a surface of the PCB. The layer of material is to apply an expansive or contractive force to a surface of the PCB in response to being warmed by heat generated by the heating element. The expansive or contractive force is to cause the first surface to expand with a first coefficient of thermal expansion that is closer to a second coefficient of thermal expansion of an opposite surface of the PCB than the surface's coefficient of thermal expansion without the expansive or contractive force.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T19%3A57%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FREY,%20Emery%20E&rft.date=2021-04-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2021120663A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true