DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE

An apparatus is described. The apparatus includes a printed circuit board (PCB), a heating element and a layer of material that is physically integrated with a surface of the PCB. The layer of material is to apply an expansive or contractive force to a surface of the PCB in response to being warmed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FREY, Emery E, GULICK, John C, THIBADO, Jonathan W
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An apparatus is described. The apparatus includes a printed circuit board (PCB), a heating element and a layer of material that is physically integrated with a surface of the PCB. The layer of material is to apply an expansive or contractive force to a surface of the PCB in response to being warmed by heat generated by the heating element. The expansive or contractive force is to cause the first surface to expand with a first coefficient of thermal expansion that is closer to a second coefficient of thermal expansion of an opposite surface of the PCB than the surface's coefficient of thermal expansion without the expansive or contractive force.