PACKAGE STRUCTURE WITH BUMP

A package structure is provided. The package structure includes a molding layer and a first chip having a first corner and a second corner and a second chip having a third corner and a fourth corner embedded in the molding layer. The package structure also includes first bumps electrically connected...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANG, Ching-Fu, CHIU, Ming-Yen, HUANG, Hsin-Chieh
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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