PACKAGE STRUCTURE WITH BUMP

PACKAGE STRUCTURE WITH BUMP

A package structure is provided. The package structure includes a molding layer and a first chip having a first corner and a second corner and a second chip having a third corner and a fourth corner embedded in the molding layer. The package structure also includes first bumps electrically connected...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHANG, Ching-Fu, CHIU, Ming-Yen, HUANG, Hsin-Chieh
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package structure is provided. The package structure includes a molding layer and a first chip having a first corner and a second corner and a second chip having a third corner and a fourth corner embedded in the molding layer. The package structure also includes first bumps electrically connected to the first chip without overlapping the first chip and the second chip. In addition, the first corner and the second corner of the first chip and the third corner and the fourth corner of the second chip form a first region in a top view, and no bump overlaps the first region.