APPARATUS FOR AND METHOD OF POLISHING SURFACE OF SUBSTRATE

According to one or more embodiments, there is provided an apparatus for polishing a surface of a substrate to remove a resin layer formed on the surface of the substrate having a groove, the apparatus including: a laser irradiation apparatus configured to irradiate a laser to the resin layer to rem...

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Bibliographische Detailangaben
Hauptverfasser:	KANG, Sung Il, KU, Jong Hoe, BAE, In Seob, PARK, Se Chuel
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	According to one or more embodiments, there is provided an apparatus for polishing a surface of a substrate to remove a resin layer formed on the surface of the substrate having a groove, the apparatus including: a laser irradiation apparatus configured to irradiate a laser to the resin layer to remove at least a portion of a resin from the resin layer except for a portion of the resin layer arranged in the groove.