Interconnect Clip with Angled Contact Surface and Raised Bridge Technical Field

An interconnect clip includes a die contact portion having planar upper and lower surfaces, a bridge portion adjoining the die contact portion and having planar upper and lower surfaces, a lead contact portion adjoining the bridge portion and having first and second planar lower surfaces that form a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Chai Chee, Tay, Wee Boon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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