Interconnect Clip with Angled Contact Surface and Raised Bridge Technical Field

An interconnect clip includes a die contact portion having planar upper and lower surfaces, a bridge portion adjoining the die contact portion and having planar upper and lower surfaces, a lead contact portion adjoining the bridge portion and having first and second planar lower surfaces that form a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lee, Chai Chee, Tay, Wee Boon
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An interconnect clip includes a die contact portion having planar upper and lower surfaces, a bridge portion adjoining the die contact portion and having planar upper and lower surfaces, a lead contact portion adjoining the bridge portion and having first and second planar lower surfaces that form an angled intersection with one another at a contact point, a first transition surface extending transversely from the lower surface of the bridge portion, and a second transition surface extending transversely from the lower surface of the bridge portion. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends from the first transition surface to the second transition surface along a second plane that is completely above the first plane. The first lower surface of the lead contact portion is tilted relative to the first plane.