SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE

In one general aspect, a semiconductor device package can include a die attach paddle having a first surface and a second surface that is opposite the first surface. The package can also include a semiconductor die coupled with the first surface of the die attach paddle. The package can further include a direct-bonded-metal (DBM) substrate. The DBM substrate can include a ceramic layer having a first surface and a second surface that is opposite the first surface; a first metal layer disposed on the first surface of the ceramic layer and coupled with the second surface of the die attach paddle; and a second metal layer disposed on the second surface of the ceramic layer. The second metal layer can be exposed external to the semiconductor device package. The second metal layer can be electrically isolated from the first metal layer by the ceramic layer.