CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING

CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING

An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechani...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PETERNEL, Joyce J. M, RAZDAN, Sandeep, MAKER, Ashley J, TRAVERSO, Matthew J, PRASAD, Aparna R
Format: Patent
Sprache:eng
Schlagworte:
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Beschreibung
Zusammenfassung:An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.