MULTIPLE CIRCUIT BOARDS WITH HIGH-DENSITY COMPRESSION INTERCONNECT

MULTIPLE CIRCUIT BOARDS WITH HIGH-DENSITY COMPRESSION INTERCONNECT

A printed circuit board (PCB) assembly includes a first PCB, a high-speed PCB, and a high-speed interconnect electrically and physically connecting the first PCB and the high-speed PCB.

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Bibliographische Detailangaben
Hauptverfasser: MCMORROW, Norman S, GUETIG, Keith R, SHAH, Jignesh H
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A printed circuit board (PCB) assembly includes a first PCB, a high-speed PCB, and a high-speed interconnect electrically and physically connecting the first PCB and the high-speed PCB.