Methods and Devices Related to Radio Frequency Devices

A method includes providing a semiconductor substrate having a first side and a second side opposite to the first side, forming at least one radio frequency device at the first side; thinning the semiconductor substrate from the second side; and processing the second side of the thinned semiconducto...

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Bibliographische Detailangaben
Hauptverfasser:	Feick, Henning, Cattaneo, Andrea, Taddiken, Hans, Seidel, Uwe, Solomko, Valentyn, Heiss, Dominik, Butschkow, Christian, Kadow, Christoph, Steltenpohl, Anton
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method includes providing a semiconductor substrate having a first side and a second side opposite to the first side, forming at least one radio frequency device at the first side; thinning the semiconductor substrate from the second side; and processing the second side of the thinned semiconductor substrate to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device.