METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION

METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION

Methods and apparatus for reducing warpage of a substrate. In some embodiments, a method of reducing substrate warpage comprises heating the substrate with an epoxy layer to at least a glass transition temperature of the epoxy layer while allowing the substrate to expand; maintaining the at least th...

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Bibliographische Detailangaben
Hauptverfasser: TAN, Chin Wei, PARATHITHASAN, Karrthik, ARUNAKIRI, Manorajh, TAN, Puay Han, LIM, Fang Jie, TEO, Wei Jie Dickson, SU, Jun-Liang, PENG, Qi Jie, LIANTO, Prayudi, SUNDARRAJAN, Arvind, THIRUNAVUKARASU, Sriskantharajah
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Methods and apparatus for reducing warpage of a substrate. In some embodiments, a method of reducing substrate warpage comprises heating the substrate with an epoxy layer to at least a glass transition temperature of the epoxy layer while allowing the substrate to expand; maintaining the at least the glass transition temperature of the substrate until the substrate is constrained; constraining the substrate with a total clamping force of approximately 5000N to approximately 7000N exerted towards the substrate from a top direction and a bottom direction; applying at least one electrostatic field to the substrate with a first electrostatic chuck positioned above the substrate and a second electrostatic chuck positioned below the substrate; and rapidly cooling the substrate using a first liquid convection heat sink positioned above the substrate and a second liquid convection heat sink positioned below the substrate.