SOLDER MATERIAL

A solder material including 2.5-3.3 wt % Ag, 0.3-0.5 wt % Cu 5.5-6.4 wt % In, and 0.5-1.4 wt % Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.

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Bibliographische Detailangaben
Hauptverfasser:	Oomori, Kouki, Isumi, Mitsuhiro, Hirai, Yukihiko, Tsuchiya, Ayaka
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A solder material including 2.5-3.3 wt % Ag, 0.3-0.5 wt % Cu 5.5-6.4 wt % In, and 0.5-1.4 wt % Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.