POLYAMIC ACID, POLYAMIC ACID SOLUTION, POLYIMIDE, POLYIMIDE FILM, LAMINATE AND FLEXIBLE DEVICE, AND METHOD FOR PRODUCING POLYIMIDE FILM

A polyamic acid that is a polyaddition reaction product of a diamine and a tetracarboxylic dianhydrides, according to one or more embodiments of the present invention. The polyamic acid contains 2′-bistrifluoromethylbenzidine as a diamine component in addition to 3,3′,4,4′-biphenyltetracarboxylic di...

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Bibliographische Detailangaben
1. Verfasser:	Uno, Mari
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	A polyamic acid that is a polyaddition reaction product of a diamine and a tetracarboxylic dianhydrides, according to one or more embodiments of the present invention. The polyamic acid contains 2′-bistrifluoromethylbenzidine as a diamine component in addition to 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride as tetracarboxylic dianhydride components. The polyamic acid may include 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride in an amount ranging from 0.5 mol % or more to 10 mol % or less based on total amount of the tetracarboxylic anhydride.