COOLING APPARATUS WITH TWO-TIER VAPOR CHAMBER

In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity de...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Dhandapani, Kathiravan, Raju, Prakash Kurma, Shaikh, Javed
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus.