SHIELDED ELECTRONIC MODULES AND METHODS OF FORMING THE SAME UTILIZING PLATING AND DOUBLE-CUT SINGULATION

SHIELDED ELECTRONIC MODULES AND METHODS OF FORMING THE SAME UTILIZING PLATING AND DOUBLE-CUT SINGULATION

The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shieldin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Morris, Thomas Scott, Davisson, John, Holt, Jerry, Nevarez, Rommel Quintero, Parker, Stephen Craig
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.