SEMICONDUCTOR STRUCTURE

A semiconductor structure includes a semiconductor device, a plurality of through semiconductor vias (TSV), a first seal ring, and a second seal ring. The TSVs penetrate through the semiconductor device. The TSVs are adjacent to an edge of the semiconductor device. The first seal ring is disposed on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wang, Rung-De, Wang, Chia-Hua, Tsai, Pei-Shing, Ku, Chin-Yu, Liu, Chen-Hsun, Pang, Te-Hsun, Lin, Po-Chang
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:A semiconductor structure includes a semiconductor device, a plurality of through semiconductor vias (TSV), a first seal ring, and a second seal ring. The TSVs penetrate through the semiconductor device. The TSVs are adjacent to an edge of the semiconductor device. The first seal ring is disposed on and physically connected to one end of each of the TSVs. The second seal ring is disposed on and physically connected to another end of each of the TSVs.